Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

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Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron micros...

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Bibliographic Details
Main Authors:	Gain, A., Zhang, L., Quadir, Md Zakaria
Format:	Journal Article
Published:	Elsevier 2016
Online Access:	http://hdl.handle.net/20.500.11937/20798

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