Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron micros...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2016
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| Online Access: | http://hdl.handle.net/20.500.11937/20798 |