Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron micros...
| Main Authors: | , , |
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| Format: | Journal Article |
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Elsevier
2016
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| Online Access: | http://hdl.handle.net/20.500.11937/20798 |
| _version_ | 1848750409846358016 |
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| author | Gain, A. Zhang, L. Quadir, Md Zakaria |
| author_facet | Gain, A. Zhang, L. Quadir, Md Zakaria |
| author_sort | Gain, A. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron microscopy (SEM), electron backscattered diffraction (EBSD) and diffraction analysis with transmission electron microscopy (TEM). In the as-received alloy Cu6Sn5 intermetallic compound (IMC) particles are dispersed in the grain interiors and grain boundaries of ß-Sn matrix. When the alloy was exposed for 60 days at 150 °C, the size of Cu6Sn5 IMC particles and Sn matrix grains were increased significantly. As a result the mechanical reliability of electronic interconnections turned inferior. This was confirmed by measuring a range of electrical and mechanical properties that include electrical resistivity, Young's moduli, shear moduli, microhardness and nano indentation creep behaviour. A comparison between the as-received and age-treated alloy shows that the degradation in Young's and shear moduli was about 10.6 and 9.9%, respectively, and that in hardness was about 25%. However the age treatment improved the damping property of the alloy. |
| first_indexed | 2025-11-14T07:36:23Z |
| format | Journal Article |
| id | curtin-20.500.11937-20798 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T07:36:23Z |
| publishDate | 2016 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-207982017-09-13T13:51:44Z Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy Gain, A. Zhang, L. Quadir, Md Zakaria This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron microscopy (SEM), electron backscattered diffraction (EBSD) and diffraction analysis with transmission electron microscopy (TEM). In the as-received alloy Cu6Sn5 intermetallic compound (IMC) particles are dispersed in the grain interiors and grain boundaries of ß-Sn matrix. When the alloy was exposed for 60 days at 150 °C, the size of Cu6Sn5 IMC particles and Sn matrix grains were increased significantly. As a result the mechanical reliability of electronic interconnections turned inferior. This was confirmed by measuring a range of electrical and mechanical properties that include electrical resistivity, Young's moduli, shear moduli, microhardness and nano indentation creep behaviour. A comparison between the as-received and age-treated alloy shows that the degradation in Young's and shear moduli was about 10.6 and 9.9%, respectively, and that in hardness was about 25%. However the age treatment improved the damping property of the alloy. 2016 Journal Article http://hdl.handle.net/20.500.11937/20798 10.1016/j.matdes.2016.08.007 Elsevier restricted |
| spellingShingle | Gain, A. Zhang, L. Quadir, Md Zakaria Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title_full | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title_fullStr | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title_full_unstemmed | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title_short | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| title_sort | thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy |
| url | http://hdl.handle.net/20.500.11937/20798 |