Gain, A., Zhang, L., & Quadir, M. Z. (2016). Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy. Elsevier.
Chicago Style (17th ed.) CitationGain, A., L. Zhang, and Md Zakaria Quadir. Thermal Aging Effects on Microstructures and Mechanical Properties of an Environmentally Friendly Eutectic Tin-copper Solder Alloy. Elsevier, 2016.
MLA (9th ed.) CitationGain, A., et al. Thermal Aging Effects on Microstructures and Mechanical Properties of an Environmentally Friendly Eutectic Tin-copper Solder Alloy. Elsevier, 2016.
Warning: These citations may not always be 100% accurate.