A modified layer-removal method for residual stress measurement in electrodeposited nickel films

Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantileve...

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Main Authors: Jiang, L., Peng, J., Liao, Y., Zhou, Y.C., Liang, J., Hao, H.X., Lu, Chungsheng
Format: Journal Article
Published: Elsevier Science SA 2011
Subjects:
Online Access:http://hdl.handle.net/20.500.11937/18476
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author Jiang, L.
Peng, J.
Liao, Y.
Zhou, Y.C.
Liang, J.
Hao, H.X.
Lu, Chungsheng
author_facet Jiang, L.
Peng, J.
Liao, Y.
Zhou, Y.C.
Liang, J.
Hao, H.X.
Lu, Chungsheng
author_sort Jiang, L.
building Curtin Institutional Repository
collection Online Access
description Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantilever beam is measured by the digital speckle correlation method. The results show that residual stress in a single semimat nickel film is compressive, while in a multi-layer system composed of dark, semimat and holophote nickel, residual stress in the surface layer is tensile. Residual stress decreases gradually with the increase of etching depths of single and multi-layer films. These findings are in qualitative agreement with nanoindentation tests, which confirms the reliability of the modified layer-removal method.
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institution Curtin University Malaysia
institution_category Local University
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publishDate 2011
publisher Elsevier Science SA
recordtype eprints
repository_type Digital Repository
spelling curtin-20.500.11937-184762019-02-19T05:34:59Z A modified layer-removal method for residual stress measurement in electrodeposited nickel films Jiang, L. Peng, J. Liao, Y. Zhou, Y.C. Liang, J. Hao, H.X. Lu, Chungsheng Residual stress Nanoindentation Nickel Layer-removal method Thin films Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantilever beam is measured by the digital speckle correlation method. The results show that residual stress in a single semimat nickel film is compressive, while in a multi-layer system composed of dark, semimat and holophote nickel, residual stress in the surface layer is tensile. Residual stress decreases gradually with the increase of etching depths of single and multi-layer films. These findings are in qualitative agreement with nanoindentation tests, which confirms the reliability of the modified layer-removal method. 2011 Journal Article http://hdl.handle.net/20.500.11937/18476 10.1016/j.tsf.2011.01.260 Elsevier Science SA fulltext
spellingShingle Residual stress
Nanoindentation
Nickel
Layer-removal method
Thin films
Jiang, L.
Peng, J.
Liao, Y.
Zhou, Y.C.
Liang, J.
Hao, H.X.
Lu, Chungsheng
A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title_full A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title_fullStr A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title_full_unstemmed A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title_short A modified layer-removal method for residual stress measurement in electrodeposited nickel films
title_sort modified layer-removal method for residual stress measurement in electrodeposited nickel films
topic Residual stress
Nanoindentation
Nickel
Layer-removal method
Thin films
url http://hdl.handle.net/20.500.11937/18476