Comparison between SAC405 lead-free solders and EN(P)EPIG and EN(B)EPIG surface finishes
In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the le...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/6378/ http://eprints.uthm.edu.my/6378/1/59.pdf |