The effect of immersion silver thickness on intermetallics formed in sn-3.8ag-0.7cu leadfree solders
Immersion silver is one of an alternative surface finish to printed circuit board electronic assembly in electronic packaging industry. In this study, the effect of immersion silver thickness on interfacial reactions or IMC that occur during soldering between Sn-3.8Ag-0.7Cu (SAC3807) lead-free solde...
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| Format: | Conference or Workshop Item |
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2009
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| Online Access: | http://eprints.uthm.edu.my/1957/ http://eprints.uthm.edu.my/1957/1/THE_EFFECT_OF_IMMERSION_SILVER_THICKNESS_SALIZA_AZLINA_OSMAN_2009.pdf |