Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk

The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic...

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Main Authors:	Wong, K. K., Lee, Chnoong Kheng, Low, Kun She, Haron, Md. Jelas
Format:	Article
Language:	English
Published:	Elsevier 2003
Online Access:	http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf

id	upm-40033
recordtype	eprints
spelling	upm-400332015-08-27T00:36:05Z http://psasir.upm.edu.my/id/eprint/40033/ Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles. Elsevier 2003-12 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf Wong, K. K. and Lee, Chnoong Kheng and Low, Kun She and Haron, Md. Jelas (2003) Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk. Process Biochemistry, 39 (4). pp. 437-445. ISSN 1359-5113; ESSN: 1873-3298 http://www.sciencedirect.com/science/article/pii/S0032959203000943 10.1016/S0032-9592(03)00094-3
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Putra Malaysia
building	UPM Institutional Repository
collection	Online Access
language	English
description	The potential of using tartaric acid modified rice husk (TARH) as a sorbent for the removal of Cu and Pb from semiconductor electroplating wastewater was investigated. Application of Langmuir isotherm indicated that there was no difference in the sorption capacity of TARH for Cu and Pb in synthetic solution and wastewater. A series of column studies were carried out. Increase in column bed depth yielded longer service time while increase in influent concentration and flow rate resulted in faster breakthrough. The sorption capacities of the TARH column for Cu and Pb agreed closely with the levels obtained from batch equilibrium studies. Theoretical breakthrough curves at different bed heights and flow rates generated using a two-parameter model agreed closely with experimental values in the treatment of semiconductor wastewater. In the regeneration study, Cu and Pb could be recovered almost quantitatively by eluting the column with 0.1 M HCl and the column could be used repeatedly for at least five cycles.
format	Article
author	Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas
spellingShingle	Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
author_facet	Wong, K. K. Lee, Chnoong Kheng Low, Kun She Haron, Md. Jelas
author_sort	Wong, K. K.
title	Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_short	Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_full	Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_fullStr	Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_full_unstemmed	Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk
title_sort	removal of cu and pb from electroplating wastewater using tartaric acid modified rice husk
publisher	Elsevier
publishDate	2003
url	http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/ http://psasir.upm.edu.my/id/eprint/40033/1/Removal%20of%20Cu%20and%20Pb%20from%20electroplating%20wastewater%20using%20tartaric%20acid%20modified%20rice%20husk.pdf
first_indexed	2018-09-07T16:56:58Z
last_indexed	2018-09-07T16:56:58Z
_version_	1610968641895923712

Removal of Cu and Pb from electroplating wastewater using tartaric acid modified rice husk

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