Thermal characteristic of sintered Ag-Cu nanopaste for high-temperature die-attach application
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture of nano-sized Ag and Cu particles and organic compounds meant for high-temperature die-attach application is reported. The Ag-Cu nanopaste was sintered at 380 degrees C for 30 min without the need of a...
| Main Authors: | , , |
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| Format: | Article |
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2015
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S1290072914002488 http://www.sciencedirect.com/science/article/pii/S1290072914002488 http://eprints.um.edu.my/13918/1/Thermal_characteristic_of_sintered_Ag%2DCu_nanopaste_for_high.pdf |