Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powd...

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Main Authors:	Li, Jiaxiang, Li, Yunping, Wang, Zhongchang, Bian, Huakang, Hou, Yuhang, Wang, Fenglin, Xu, Guofu, Liu, Bin, Liu, Yong
Format:	Online
Language:	English
Published:	Nature Publishing Group 2016
Online Access:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5177874/

id	pubmed-5177874
recordtype	oai_dc
spelling	pubmed-51778742016-12-29 Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder Li, Jiaxiang Li, Yunping Wang, Zhongchang Bian, Huakang Hou, Yuhang Wang, Fenglin Xu, Guofu Liu, Bin Liu, Yong Article The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the key challenges in developing next-generation electrical transferring powder. Here, we fabricate a Cu-Ag powder with a continuous Ag network along grain boundaries of Cu particles and demonstrate that this new structure can inhibit the preferential oxidation in grain boundaries at elevated temperatures. As a result, the Cu-Ag powder displays considerably high electrical conductivity and high oxidation resistance up to approximately 300 °C, which are markedly higher than that of pure Cu powder. This study paves a new pathway for developing novel Cu powders with much enhanced electrical conductivity and oxidation resistance in service. Nature Publishing Group 2016-12-22 /pmc/articles/PMC5177874/ /pubmed/28004839 http://dx.doi.org/10.1038/srep39650 Text en Copyright © 2016, The Author(s) http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
repository_type	Open Access Journal
institution_category	Foreign Institution
institution	US National Center for Biotechnology Information
building	NCBI PubMed
collection	Online Access
language	English
format	Online
author	Li, Jiaxiang Li, Yunping Wang, Zhongchang Bian, Huakang Hou, Yuhang Wang, Fenglin Xu, Guofu Liu, Bin Liu, Yong
spellingShingle	Li, Jiaxiang Li, Yunping Wang, Zhongchang Bian, Huakang Hou, Yuhang Wang, Fenglin Xu, Guofu Liu, Bin Liu, Yong Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
author_facet	Li, Jiaxiang Li, Yunping Wang, Zhongchang Bian, Huakang Hou, Yuhang Wang, Fenglin Xu, Guofu Liu, Bin Liu, Yong
author_sort	Li, Jiaxiang
title	Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
title_short	Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
title_full	Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
title_fullStr	Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
title_full_unstemmed	Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder
title_sort	ultrahigh oxidation resistance and high electrical conductivity in copper-silver powder
description	The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the key challenges in developing next-generation electrical transferring powder. Here, we fabricate a Cu-Ag powder with a continuous Ag network along grain boundaries of Cu particles and demonstrate that this new structure can inhibit the preferential oxidation in grain boundaries at elevated temperatures. As a result, the Cu-Ag powder displays considerably high electrical conductivity and high oxidation resistance up to approximately 300 °C, which are markedly higher than that of pure Cu powder. This study paves a new pathway for developing novel Cu powders with much enhanced electrical conductivity and oxidation resistance in service.
publisher	Nature Publishing Group
publishDate	2016
url	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5177874/
_version_	1613811084937920512

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

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