A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capa...

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Bibliographic Details
Main Authors: Xie, Bo, Xing, Yonghao, Wang, Yanshuang, Chen, Jian, Chen, Deyong, Wang, Junbo
Format: Online
Language:English
Published: MDPI 2015
Online Access:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4610534/

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https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4610534/

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