Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system
Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanopar...
| Main Authors: | , , , , |
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| Format: | Online |
| Language: | English |
| Published: |
Elsevier B.V
2015
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| Online Access: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4456117/ |