Scanning electrochemical microscopy studies of micropatterned copper sulfide (CuxS) thin films fabricated by a wet chemistry method
► Copper sulfide (CuxS) microstructures on Si wafer has been prepared using a wet chemistry method. ► To obtain high quality CuxS films, preparative conditions were optimized. Scanning electrochemical microscopy (SECM) was employed to examine the properties of the CuxS films. ► The apparent electron...
| Main Authors: | , , |
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| Format: | Online |
| Language: | English |
| Published: |
Pergamon Press
2011
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| Online Access: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3112495/ |
| Summary: | ► Copper sulfide (CuxS) microstructures on Si wafer has been prepared using a wet chemistry method. ► To obtain high quality CuxS films, preparative conditions were optimized. Scanning electrochemical microscopy (SECM) was employed to examine the properties of the CuxS films. ► The apparent electron-transfer rate constant (k) of CuxS surface was estimated as 0.04 cm/s. ► The SECM current map showed high edge acuity of the micro-patterned CuxS. |
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