Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5Cu and Sn-37Pb solders with Ni/Au layers
The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/A...
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| Format: | Journal |
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International Journal of Automotive and Mechanical Engineering, Universiti Malaysia Pahang Publishing (UMP Publisher)
2013
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| Online Access: | http://www.myjurnal.my/public/article-view.php?id=76928 |