Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables
An effort to design and build a prototype LED driver system which is energy efficient, highly compact and with few component count was initiated by a consortium UK universities. The prototype system will be based on Silicon Lateral IGBT (LIGBT) device combined with chip on board technology. Part oft...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2018
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| Online Access: | http://eprints.nottingham.ac.uk/51681/ http://eprints.nottingham.ac.uk/51681/ http://eprints.nottingham.ac.uk/51681/ http://eprints.nottingham.ac.uk/51681/1/Impact%20of%20underfill%20and%20other%20physical%20dimensions%20on%20Silicon%20Lateral%20IGB.._.pdf |