In-service diagnostics for wire-bond lift-off and solder fatigue of power semiconductor packages
Wire-bond lift-off and Solder fatigue are degradation mechanisms that dominate the lifetime of power semiconductor packages. Although their lifetime is commonly estimated at the design stage, based on mission profiles and Physics-of-Failure models, there are many uncertainties associated with such l...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2017
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| Online Access: | http://eprints.nottingham.ac.uk/39589/ http://eprints.nottingham.ac.uk/39589/ http://eprints.nottingham.ac.uk/39589/ http://eprints.nottingham.ac.uk/39589/8/07835255.pdf |