Skip to content
VuFind
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
"Hot" packaging issues prompts...
Holdings
Cite this
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium
Bibliographic Details
Format:
text
Language:
eng
Published:
Emerald
2000
Subjects:
IMAPS,Packaging
Holdings
Description
Similar Items
Staff View
Similar Items
IMAPS topical workshop on Optoelectronics Packaging and MOEMS
Published: (2002)
IMAPS USA. IMAPS optoelectronics packaging advanced technology workshop program announced
Published: (2001)
The Nordic Electronics Packaging Guideline
Published: (2000)
Boston's Hynes Convention Center is site for International Microelectronics and Packaging Society (IMAPS) Year 2000 Annual Symposium
Published: (2000)
Foldable Flex and Thinned Silicon Chips for Multichip Packaging
by: Johan, Liu
Published: (2003)
×
Loading...