Copper Ball/Wedge Bonding to Copper Thick Film
| Main Authors: | , |
|---|---|
| Format: | text |
| Language: | eng |
| Published: |
Emerald
1988
|
| id |
10.1108-eb044303 |
|---|---|
| recordtype |
eprints |
| spelling |
10.1108-eb0443031988-01-01 Copper Ball/Wedge Bonding to Copper Thick Film R.V., Winkle R.V., Winkle S.R., Cater S.R., Cater Emerald 1988-01-01 text text/HTML 10.1108/eb044303 https://www.emeraldinsight.com/doi/10.1108/eb044303 ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.jtitle=Microelectronics+International&rft.volume=5&rft.issue=1&rft.spage=13&rft.epage=17&rft.issn=1356-5362&rft.id=info%3Adoi%2F10.1108%2Feb044303 eng Emerald All rights reserved. |
| repository_type |
Digital Repository |
| institution_category |
Foreign Institution |
| institution |
Emerald |
| building |
Emerald Repository |
| collection |
Online Access |
| language |
eng |
| description |
|
| author2 |
R.V., Winkle |
| author_facet |
R.V., Winkle R.V., Winkle S.R., Cater |
| format |
text |
| author |
R.V., Winkle S.R., Cater |
| spellingShingle |
R.V., Winkle S.R., Cater Copper Ball/Wedge Bonding to Copper Thick Film |
| author_sort |
R.V., Winkle |
| title |
Copper Ball/Wedge Bonding to Copper Thick Film |
| title_short |
Copper Ball/Wedge Bonding to Copper Thick Film |
| title_full |
Copper Ball/Wedge Bonding to Copper Thick Film |
| title_fullStr |
Copper Ball/Wedge Bonding to Copper Thick Film |
| title_full_unstemmed |
Copper Ball/Wedge Bonding to Copper Thick Film |
| title_sort |
copper ball/wedge bonding to copper thick film |
| publisher |
Emerald |
| publishDate |
1988 |
| first_indexed |
2018-10-12T07:33:53Z |
| last_indexed |
2018-10-12T07:33:53Z |
| _version_ |
1614104109690912768 |