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Comparing the reliability and...
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Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering
Bibliographic Details
Main Author:
Olivér, Krammer
Format:
text
Language:
eng
Published:
Emerald
2014
Subjects:
Reliability,Image processing,Shear strength,Intermetallic compounds,Highly accelerated stress test,Vapour phase soldering
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