Bibliographic Details
| Main Authors: |
Mei-Ling, Wu,
Jia-Shen, Lan |
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| Format: | text
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| Language: | eng |
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| Published: |
Emerald
2016
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| Subjects: |
Modelling,Finite element modelling (FEM),Interconnections,Thermal fatigue,Fatigue,Joint resistance,Thermal management,3D IC package,Coefficient thermal expansion,Through-silicon-vias,Finite element methodology,Thermal failure
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