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High temperature creep propert...
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High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method
Bibliographic Details
Main Authors:
Xiangxia, Kong
,
F., Sun
,
Miaosen, Yang
,
Yang, Liu
Format:
text
Language:
eng
Published:
Emerald
2016
Subjects:
High temperature,Nanoindentation,Creep property,Micro solder joints
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