Temperature effects in the analysis of electromechanical impedance by using spectral element method

Temperature effects in the analysis of electromechanical impedance by using spectral element method

Bibliographic Details
Main Authors: Guidong, Xu, Baiqiang, Xu, Chenguang, Xu, Ying, Luo
Format: text
Language:eng
Published: Emerald 2016
Subjects:
Electromechanical impedance,Spectral element method,Temperature-dependent model,Structural health modelling,Electromechanical properties,Temperature effects

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