Characterisation of Polyimide‐glass‐metal Joints Bonded with Anisotropic Electrically Conductive Adhesives

Bibliographic Details
Main Authors:	P., Savolainen, J., Kivilahti
Format:	text
Language:	eng
Published:	Emerald 1996
Subjects:	Bonding joints,Tape automated bonding,Thermoplastic adhesive,Adhesives,Microelectronics

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