Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Bibliographic Details
Main Authors: Chun‐Sean, Lau, M.Z., Abdullah, F., Che Ani
Format: text
Language:eng
Published: Emerald 2012
Subjects:
Flow,Soldering,Convection,Forced convection reflow,Computational fluid dynamics,Finite element method,Thermal coupling method,Ball grid array assembly

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