Skip to content
VuFind
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Silver nanoparticles effect on...
Holdings
Cite this
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper
Bibliographic Details
Main Authors:
K., Bukat
,
M., Kościelski
,
J., Sitek
,
M., Jakubowska
,
A., Młożniak
Format:
text
Language:
eng
Published:
Emerald
2011
Subjects:
Solder paste,Wetting,Silver,Alloys,Metallurgy,Nanoparticle addition,Microstructure of “nano” solder joints
Holdings
Description
Similar Items
Staff View
Similar Items
SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure
by: Krystyna, Bukat, et al.
Published: (2013)
SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
by: K., Bukat, et al.
Published: (2012)
A review: lead free solder and its wettability properties
by: Ervina Efzan, Mhd Noor, et al.
Published: (2016)
Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
by: Z., Moser, et al.
Published: (2011)
Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders
by: Krystyna, Bukat, et al.
Published: (2012)
×
Loading...