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Enhanced thermal fatigue endur...
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Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules
Bibliographic Details
Main Authors:
O., Nousiainen
,
O., Salmela
,
J., Putaala
,
T., Kangasvieri
Format:
text
Language:
eng
Published:
Emerald
2011
Subjects:
Solders,Thermal properties of materials,Metals,Fatigue
Holdings
Description
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