Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

Bibliographic Details
Main Authors:	John, Lau, Jerry, Gleason, Valeska, Schroeder, Gregory, Henshall, Walter, Dauksher, Bob, Sullivan
Format:	text
Language:	eng
Published:	Emerald 2008
Subjects:	Solder,Lead,Low temperatures,Packaging processes,Density

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