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Strategies for improving the r...
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Strategies for improving the reliability of solder joints on power semiconductor devices
Bibliographic Details
Main Authors:
Guo‐Quan, Lu
,
Xingsheng, Liu
,
Sihua, Wen
,
Jesus, Noel Calata
,
John G., Bai
Format:
text
Language:
eng
Published:
Emerald
2004
Subjects:
Soldering,Joining processes,Stress (materials),Semiconductor devices
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