Strategies for improving the reliability of solder joints on power semiconductor devices

Bibliographic Details
Main Authors:	Guo‐Quan, Lu, Xingsheng, Liu, Sihua, Wen, Jesus, Noel Calata, John G., Bai
Format:	text
Language:	eng
Published:	Emerald 2004
Subjects:	Soldering,Joining processes,Stress (materials),Semiconductor devices

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