Skip to content
VuFind
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Search
A study of solder paste printi...
Holdings
Cite this
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
A study of solder paste printing requirements for CSP technology
Bibliographic Details
Main Author:
Jeff, Kennedy
Format:
text
Language:
eng
Published:
Emerald
2000
Subjects:
Solder paste,Printing,Chipscale packaging,Stencils,Design,SMTA
Holdings
Description
Similar Items
Staff View
Similar Items
Correlation of solder paste rheology with computational simulations of the stencil printing process
by: R., Durairaj, et al.
Published: (2002)
Critical factors affecting paste flow during the stencil printing of solder paste
by: R., Durairaj, et al.
Published: (2001)
Characterization of a solder paste printing process and its optimization
by: Gary K.K., Poon, et al.
Published: (1999)
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
by: Oliver, Krammer, et al.
Published: (2017)
Stencil design for mixed technology throughâhole/SMT placement and reflow
by: William E., Coleman, et al.
Published: (2000)
×
Loading...