Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

by Guang, Zeng, Songbai, Xue, Liang, Zhang, Zhong, Sheng, Lili, Gao
Published 2010

Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder

by Huan, Ye, Songbai, Xue, Cheng, Chen, Yang, Li
Published 2013

Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder

by Peng, Xue, Songbai, Xue, Yifu, Shen, Zhengxiang, Xiao, Hong, Zhu, Weimin, Long, Xinquan, Yu
Published 2012