The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition

by Md Arshad, M.K., Jalar, A., Ahmad, I., Omar, G.
Published 2017

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

by Md Arshad, M.K., Jalar, A., Ahmad, I.
Published 2017

The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition

by Md Arshad, M.K., Ahmad, I., Jalar, A., Omar, G.
Published 2017

The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition

by Md Arshad, M.K., Ahmad, I., Jalar, A., Omar, G., Hashim, U.
Published 2017

Aptamer-based impedimetric determination of the human blood clotting factor IX in serum using an interdigitated electrode modified with a ZnO nanolayer

by Cheen, O.C., Gopinath, S.C.B., Perumal, V., Md Arshad, M.K., Lakshmipriya, T., Chen, Y., Haarindraprasad, R., Rao, B.S., Hashim, U., Pandian, K.
Published 2017

Top-Down Nanofabrication and Characterization of 20 nm Silicon Nanowires for Biosensing Applications

by M. N, M. Nuzaihan, Hashim, U., Md Arshad, M. K., Ruslinda, A. Rahim, Rahman, S. F. A., Fathil, M. F. M., Ismail, Mohd. H.
Published 2016

Structural, optical and electrical properties of Cu2Zn1−xCdxSnS4 quinternary alloys nanostructures deposited on porous silicon

by Ibraheam, A.S., Al-Douri, Y., Al-Fhdawi, J.M.S., Al-Jumaili, H.S., Verma, K.D., Hashim, U., Ayub, R.M., Rahim Ruslinda, A., Md Arshad, M.K., Reshak, A.H., Hamid, S.B.A.
Published 2016

Characterization Of Intermetallic Growth Of Gold Ball Bonds On Aluminum Bond Pads

by master administrator
Published 2008

Under Bump Metallurgy (UBM) A Technology Review For Flip Chip

by master administrator
Published 2007