Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

by Jagjiwan, Mittal, Kwang-Lung, Lin
Published 2018

High dislocation density of tin induced by electric current

by Yi-Han Liao, Chien-Lung Liang, Kwang-Lung Lin, Albert T. Wu
Published 2015-12-01

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

by De‐Shin, Liu, Chang‐Lin, Hsu, Chia‐Yuan, Kuo, Ya‐Ling, Huang, Kwang‐Lung, Lin, Geng‐Shin, Shen
Published 2012