Interconnection Technology for Advanced High Density Thick Films

by M., Vrana, A., Van Calster, R., Vanden Berghe**, K., Allaert
Published 1996

Embedded passive components and PCB size – thermal effects

by D.M., Stubbs, S.H., Pulko, A.J., Wilkinson, B., Wilson, F., Christiaens, K., Allaert
Published 2000

Fabrication of High Density Multi‐chip Modules with Standard IC Production Equipment

by B., De Meulemeester, A., Van Calster, A., De Bruycker, K., Allaert
Published 1993

Photoimageable Thick Films for Multichip Modules

by M., Vrana, A., Van Calster, D., Vanicky, W., Delbare, R., Vanden Berghe, S., Demolder, K., Allaert
Published 1995