Mechanical reliability of solder joints in PCBs assembled in surface mount technology

by Janusz, Borecki, Tomasz, Serzysko
Published 2016

Assessment of stability and reliability of embedded components in printed circuit boards

by Wojciech, Steplewski, Andrzej, Dziedzic, Janusz, Borecki, Tomasz, Serzysko
Published 2017

Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors

by Wojciech, Steplewski, Andrzej, Dziedzic, Janusz, Borecki, Grazyna, Koziol, Tomasz, Serzysko
Published 2014

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

by Wojciech, Steplewski, Andrzej, Dziedzic, Janusz, Borecki, Grazyna, Koziol, Tomasz, Serzysko
Published 2014

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

by Janusz, Sitek, Marek, Koscielski, Janusz, Borecki, Tomasz, Serzysko
Published 2017

Thermal stability analysis of passive components embedded into printed circuit boards

by Wojciech, Stęplewski, Andrzej, Dziedzic, Kamil, Janeczek, Aneta, Araźna, Krzysztof, Lipiec, Janusz, Borecki, Tomasz, Serzysko
Published 2018

Reactance components embedded in printed circuit boards

by Wojciech, Stęplewski, Andrzej, Dziedzic, Adam, Kłossowicz, Paweł , Winiarski, Janusz, Borecki, Grażyna , Kozioł, Tomasz, Serzysko
Published 2015

Application of direct bonded copper substrates for prototyping of power electronic modules

by Wojciech, Grzesiak, Piotr, Maćków, Tomasz, Maj, Beata, Synkiewicz, Krzysztof, Witek, Ryszard, Kisiel, Marcin, Myśliwiec, Janusz, Borecki, Tomasz, Serzysko, Marek, Żupnik
Published 2016