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130529s2012 mau eng |
| 020 |
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|a 1437778739 (hardback : alk. paper)
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| 020 |
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|a 1437778747 (ebook)
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| 020 |
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|a 9781437778731 (hardback : alk. paper)
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| 020 |
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|a 9781437778748 (ebook)
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| 050 |
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|a TK7872.T55
|b H36 2012
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| 090 |
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|a TK7872.T55
|b H36 2012
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| 245 |
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|a Handbook of thin film deposition :
|b techniques, processes, and technologies
|c edited by Krishna Seshan
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| 250 |
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|a 3rd ed
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| 260 |
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|a Waltham, Massachusetts :
|b Elsevier ,
|c c2012
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| 300 |
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|a xviii, 392 p. :
|b ill. ;
|c 24 cm.
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| 504 |
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|a Includes bibliographical references and index
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| 505 |
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|a 1. A perspective on today's scaling challenges and possible future directions -- 2. Scaling and its implications for the integration and design of thin film and processes -- 3. Scaling-its effects on heat generation and cooling of devices. A "Thermal Moore's" law? -- 4. Sputter processing -- 5. Thin-film strain engineering and pattern effects in dielectrics CVD -- 6. Equipment and manufacturability issues in CVD processes -- 7. CMP method and practice -- 8. Process technology for copper interconnects -- 9. Optical thin films -- 10. Thin films in photovoltaics -- 11. Application of thin films in semiconductor memories
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| 650 |
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|a Thin film devices
|x Design and construction
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| 650 |
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|a Thin films
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| 700 |
1 |
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|a Seshan, Krishna ,
|e author
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| 999 |
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|a 1000159975
|b Book
|c OPEN SHELF (30 DAYS)
|e Gong Badak Campus
|