Food packaging science and technology

Bibliographic Details
Main Authors: Lee, Dong Sun , 1972- (Author), Piergiovanni, Luciano , 1950- (Author), Yam, Kit L. (Author)
Format: Book
Language:English
Published: Boca Raton : CRC Press , c2008
Series:Food Science and Technology
Subjects:

MARC

LEADER 00000cam a2200000 7i4500
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005 20180117093000.0
008 090525s2008 flu eng
020 |a 0824727797 (hbk.) 
020 |a 9780824727796 (hbk.) 
090 0 0 |a TP374   |b .L427 2008 
100 1 |a Lee, Dong Sun ,   |d 1972- ,   |e author 
245 1 0 |a Food packaging science and technology   |c Dong Sun Lee, Kit L. Yam and Luciano Piergiovanni 
260 |a Boca Raton :   |b CRC Press ,   |c c2008 
300 |a xxiv, 631 p. :   |b ill. ;   |c 24 cm. 
440 0 |a Food Science and Technology 
504 |a Includes bibliographical references (p. 618-619) and index 
505 0 |a 1. Overview of food packaging systems -- 2. Chemical structures and properties of packaging -- 3. Physical properties of packaging materials -- 4. Permeation of gas and vapor -- 5. Migration and food-package interactions -- 6. Food packaging polymers -- 7. Glass packaging -- 8. Metal packaging -- 9. Cellulosic packaging -- 10. End-of-line operations -- 11. Food packaging operations and technology -- 12. Thermally preserved food packaging: retortable and aseptic -- 13. Vacuum/modified atmosphere packaging -- 14. Microwavable packaging -- 15. Active and intelligent packaging -- 16. Shelf life of packaged food products -- 17. Food products stability and packaging requirements -- 18. Sustainable packaging -- 19. Sociological and legislative considerations 
650 0 |a Food   |x Packaging 
700 1 |a Piergiovanni, Luciano ,   |d 1950- ,   |e author 
700 1 |a Yam, Kit L. ,   |e author 
999 |a 1000126598   |b Book   |c OPEN SHELF (30 DAYS)   |e Tembila Campus 
999 |a 1000126599   |b Book   |c Open Shelf (1 Day)   |e Tembila Campus