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  1. 1

    Characterization of cast iron scrap chips toward β-FeSi2 thermoelectric materials by Nor Hairin, Assayidatul Laila, Nanko, Makoto

    Published 2014
    “…The upgrade recycling process of cast-iron scrap chips toward β-FeSi2 is regarded as an eco-friendly and cost-effective production process. …”
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  2. 2

    Effects of doping elements in β-FeSi2 prepared utilizing cast iron scrap chips by Nor Hairin, Assayidatul Laila, Nanko, Makoto, Takeda, Masatoshi

    Published 2016
    “…By doping with different substitution concentrations of Co, Mn and Al, the conduction type and properties of β-FeSi2 can be modified and improved using cast iron scrap chips as a starting material. The effects of the doping elements are discussed for preparing β-FeSi2 utilizing cast iron scrap chips. …”
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  3. 3

    Upgrade recycling of cast iron scrap chips towards β-FeSi2 thermoelectric materials by Nor Hairin, Assayidatul Laila, Nanko, Makoto, Takeda, Masatoshi

    Published 2014
    “…The upgrade recycling of cast-iron scrap chips towards β-FeSi2 thermoelectric materials is proposed as an eco-friendly and cost-effective production process. …”
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    Ships and Brunanburh by Cavill, Paul

    Published 2016
    Subjects: “…ships…”
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    Hazardous consequence dynamic simulation of LNG spill on water for ship-to-ship bunkering by Sun, Biao, Guo, K., Pareek, V.

    Published 2017
    “…The significant hazards associated with LNG ship-to-ship bunkering could involve LNG vapour dispersion and LNG pool fires. …”
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    Incorporation of surface mount technology manufacturing (chip mountung) to LED Chip on Board by Amirnudin, Saiful Nizal

    Published 2019
    “…Companies are riding on a scale economy to achieve lower costs and keep prices down; thus, keeping ahead of the competition is necessary to remain competitive. In LED Chip on Board (COB) industry, there has been a substantial increase in market demand in recent years, leading to a need for a more costeffective manufacturing process. …”
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  11. 11

    High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package by Yong, Khang Choong

    Published 2013
    “…Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. …”
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    The maximum sinkage of a ship by Gourlay, Tim, Tuck, E.

    Published 2001
    “…A ship moving steadily forward in shallow water of constant depth h is usually subject to downward forces and hence squat, which is a potentially dangerous sinkage or increase in draft. …”
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    Control of Ships and Underwater Vehicles by Do, Khac Duc

    Published 2009
    “…This strategy is then used for the development and analysis of a number of ocean-vessel control systems with the aim of achieving advanced motion control tasks including stabilization, trajectory-tracking, path-tracking and path-following. Control of Ships and Underwater Vehicles offers the reader: - new results in the nonlinear control of underactuated ocean vessels; - efficient designs for the implementation of controllers on underactuated ocean vessels; - numerical simulations and real-time implementations of the control systems designed on a scale-model ship for each controller developed to illustrate their effectiveness and afford practical guidance.…”
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    Practical control of underactuated ships by Do, Khac Duc

    Published 2010
    “…This paper presents a design of global smooth controllers that achieve the practical stabilization of arbitrary reference trajectories, including fixed points and nonadmissible trajectories for underactuated ships. These ships do not have an independent actuator in the sway axis. …”
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    A survey of on-chip monitors by Rahimipour, S., Rokhani, Fakhrul Zaman, Shafie, Suhaidi, El-Azhary, I., Flayyih, W.N.

    “…Systems on Chips (SoCs) architecture complexity is result of integrating a large numbers of cores in a single chip. …”
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    Simulation On Chip Scale Packaging by Dorai Raj, Nanthakumar

    Published 2000
    “…Simulasi terhadap pembungkusan berskala chip adalah untuk mendapatkan maklumat tanpa membuat eksperimen terhadap chip sebenar.Ia dapat menjimatkan masa dan juga mengurangkan kos.Perisian yang digunakan ialah I-DEAS dan ANSYS. …”
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  20. 20

    Hazardous Consequence Dynamic Simulation and Risk Analysis of LNG Spill on Water for Ship-to-Ship Bunkering by Sun, Biao, Liao, Suliang, Guo, Kaihua, Pareek, Vishnu

    Published 2016
    “…The significant hazards related with LNG ship-to-ship bunkering could involve LNG vapour dispersion, LNG pool fire and deflagration. …”
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