Search Results - "semiconductor device packaging"

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    Evaluation of SiC Schottky diodes using pressure contacts

    Evaluation of SiC Schottky diodes using pressure contacts by Ortiz Gonzalez, J., Alatise, O., Aliyu, Attahir Murtala, Rajaguru, Pushparajah, Castellazzi, Alberto, Ran, L., Mawby, P., Bailey, Christopher

    Published 2017
    Subjects: “…semiconductor device packaging…”
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  2. 2
    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior by Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark

    Published 2017
    Subjects: Get full text

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