Search Results - "microelectronics"
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Case Study Of ST Microelectronics N.V.
Published 2008“…ST Microelectronics N.V. is a multinational company that designs, develops,manufacturers and markets a broad range of products used in a wide variety of microelectronics applications, inluding telecommunications systems, computer systems,consumer goods, automotive products and industrial automation and control system.…”
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USM-INSTITUT TEKNOLOGI BANDUNG TO COLLABORATE IN MICROELECTRONICS
Published 2015“…PENANG, June 2015 Universiti Sains Malaysia (USM) has recently extended its strategic cooperation with Institut Teknologi Bandung (ITB), one of the leading institutions in Indonesia, to jointly develop capacity of both institutions especially in the field of Microelectronic Engineering.…”
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USM, SILTERRA SIGNS AGREEMENT IN MICROELECTRONICS INDUSTRY
Published 2016“…Bhd. for the access to the Multi Project Wafer (MPW) in completing the microelectronics ecosystem at the university which comprised of designing, confirmation, fabrication, testing and measuring as well as packaging.…”
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The master production schedule in MRP for microelectronic manufacturer
Published 2020“…To fulfill this task, our group chose CPU is one of the products in this microelectronics manufacturer. Organizing and plan the manufacture process generally occurs in production planning and control.…”
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Numerical Simulation Of A Microchannel For Microelectronic Cooling
Published 2007“…The paper discusses the numerical simulation of a micro-channel heat sink in microelectronics cooling. A three-dimensional Computational Fluid Dynamics (CFD) model was built using the commercial package, FLUENT, to investigate the conjugate fluid flow and heat transfer phenomena in a silicon-based rectangular microchannel heatsink. …”
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Numerical And Experimental Analyses Of Piezoelectric Fans For Microelectronics Cooling
Published 2010“…Hence, it is important to develop a new cooling technology to improve performance of microelectronic components, which motivates the usage of cantilever type piezoelectric bimorph structure as a miniature fan. …”
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Logical effort base adder circuits transistor sizing using constriction factor and mutative variants of particle swarm optimization algorithm / Muhammad Aiman Johari
Published 2015Subjects: “…Microelectronics…”
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Design and construction of micro fabrication cleanroom for teaching microelectronic undergraduate
Published 2006“…This facility is mainly designed for teaching undergraduate microelectronic course leading to a Bachelor’s degree. …”
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Antiferromagnetic CuMnAs multi-level memory cell with microelectronic compatibility
Published 2017“…To demonstrate the compatibility with common microelectronic circuitry, we implemented the antiferromagnetic bit cell in a standard printed circuit board managed and powered at ambient conditions by a computer via a USB interface. …”
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Analog IC test and product engineering curriculum for Malaysia microelectronics industry
Published 2014“…This paper describes the academia-industries collaboration effort in developing an analogue electronic test and product engineering to boost-up technical competencies of electronic engineering graduates particularly in microelectronic major. The program has been successfully conducted at Universiti Putra Malaysia with strong support from Texas Instruments and Teradyne.…”
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Measuring speed and direction using fiber optic technology / Nordin Jumiran
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Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications
Published 2016“…In this work, the highest capacitance value, 2.82 ± 0.64 nF, was achieved by capacitors (10 mm × 10 mm) with polyimide insulating layers thinner than 1 μm, suggesting that the polyimide inkjet printing approach is an efficient way for producing dielectric components of microelectronic devices. © 2016 The Authors Journal of Applied Polymer Science Published by Wiley Periodicals, Inc. …”
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Scalable Fabrication Of Nickel Micropillars Using Ultra-Violet Photolithography Process For Microelectronics Application
Published 2019“…In the world of semiconductors and microelectronics, a trend to vertically stack integrated circuits are highly been used as it can meet the electronic device requirements. …”
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Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies
Published 2023“…Therefore, to maintain the reliability of solder joints in recent microelectronic applications, several investigations have been conducted in the last decade to proffer solutions to the drawbacks affecting the full implementation of the Sn-based solders in advanced packaging technologies. …”
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