Search Results - "electronics packaging"

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  1. 1
    A genetic algorithm based knowledge discovery system for the design of fluid dispensing processes for electronic packaging

    A genetic algorithm based knowledge discovery system for the design of fluid dispensing processes for electronic packaging by Kwong, C., Chan, Kit Yan, Tsim, Y.

    Published 2009
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  2. 2
    A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules

    A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules by Yang, Li

    Published 2013
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  3. 3
    EEK 470 POWER DISTRIBUTION SYSTEM (JAN 2016)

    EEK 470 POWER DISTRIBUTION SYSTEM (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
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  4. 4
    EEE 554/4 DIGITAL INTEGRATED CIRCUIT DESIGN (JAN 2016)

    EEE 554/4 DIGITAL INTEGRATED CIRCUIT DESIGN (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
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  5. 5
    EEE 553 SEMICONDUCTOR DEVICES AND SOLID STATE TECHNOLOGY (JAN 2016)

    EEE 553 SEMICONDUCTOR DEVICES AND SOLID STATE TECHNOLOGY (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
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  6. 6
    EEE 542 INDUSTRIAL POWER ELECTRONICS (JAN 2016)

    EEE 542 INDUSTRIAL POWER ELECTRONICS (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
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  7. 7
    Death by `techtonic’ fault

    Death by `techtonic’ fault by Abd Razak, Dzulkifli

    Published 2010
    Subjects: “…TK7870 Electronic packaging…”
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  8. 8
    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture

    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture by Loh, Mui Soon

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
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  9. 9
    Camera Independent Face Recognition Algorithm In Visual Surveillance

    Camera Independent Face Recognition Algorithm In Visual Surveillance by Yew, Chuu Tian

    Published 2015
    Subjects: “…TK7870 Electronic packaging…”
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  10. 10
    EBB526-3 - ELECTRONIC PACKAGING - NOVEMBER 2008.

    EBB526-3 - ELECTRONIC PACKAGING - NOVEMBER 2008. by PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral

    Published 2008
    Subjects: “…TK7870 Electronic packaging…”
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  11. 11
    Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment

    Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment by M.Shukeri, Nurulfaizal

    Published 2017
    Subjects: “…TK7870 Electronic packaging…”
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  12. 12
    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy

    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy by Abdullah, Syahrul Afzal Che

    Published 2016
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  13. 13
    Validation of Colpitts Vco Design for Two Way Portable Radio Applications

    Validation of Colpitts Vco Design for Two Way Portable Radio Applications by Raj Arul, Aldrin

    Published 2013
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  14. 14
    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection

    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection by Lai, Chi Qin

    Published 2016
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  15. 15
    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification

    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification by Abdul Ghani, Ahmad Shahrizan

    Published 2015
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  16. 16
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine

    An Expert System for Trouble Shooting - Auto Wire Bonder Machine by Ng, Yu Ting

    Published 1997
    Subjects: “…Wire bonding (Electronic packaging) - Case studies…”
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  17. 17
    Improved reliability of planar power interconnect with ceramic-based structure

    Improved reliability of planar power interconnect with ceramic-based structure by Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren, Johnson, Christopher Mark

    Published 2018
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  18. 18
    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior by Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark

    Published 2017
    Subjects: “…Electronics packaging…”
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  19. 19
    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 505 – Advanced Analog Integrated Circuit Design

    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 505 – Advanced Analog Integrated Circuit Design by Elektrik & Elektronik, Pusat Pengajian Kejuruteraan

    Published 2018
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  20. 20
    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE520 – EMBEDDED MICROPROCESSOR SYSTEMS Duration : 3 hours

    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE520 – EMBEDDED MICROPROCESSOR SYSTEMS Duration : 3 hours by Elektrik & Elektronik, Pusat Pengajian Kejuruteraan

    Published 2018
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