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    Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects by Solomon, Adane Kassa, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark

    Published 2015
    Subjects: “…Bridges; Copper; Electronics packaging; Flip chip devices; Insulated gate bipolar transistors (IGBT); Power electronics Application-oriented; Copper bumps; Electromagnetic performance; Experimental test; Flip chip; Solder joints; Structural simulations; Thermo-mechanical stress Integrated circuit interconnects…”
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