Search Results - "electronic packaging"

Refine Results
  1. 1
    A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules

    A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules by Yang, Li

    Published 2013
    Subjects: Get full text
  2. 2
    EEK 470 POWER DISTRIBUTION SYSTEM (JAN 2016)

    EEK 470 POWER DISTRIBUTION SYSTEM (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  3. 3
    EEE 554/4 DIGITAL INTEGRATED CIRCUIT DESIGN (JAN 2016)

    EEE 554/4 DIGITAL INTEGRATED CIRCUIT DESIGN (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  4. 4
    EEE 553 SEMICONDUCTOR DEVICES AND SOLID STATE TECHNOLOGY (JAN 2016)

    EEE 553 SEMICONDUCTOR DEVICES AND SOLID STATE TECHNOLOGY (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  5. 5
    EEE 542 INDUSTRIAL POWER ELECTRONICS (JAN 2016)

    EEE 542 INDUSTRIAL POWER ELECTRONICS (JAN 2016) by PPKEE, Pusat Pengajian Kejuruteraan Elektrik & Elektronik

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  6. 6
    Death by `techtonic’ fault

    Death by `techtonic’ fault by Abd Razak, Dzulkifli

    Published 2010
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  7. 7
    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture

    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture by Loh, Mui Soon

    Published 2016
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  8. 8
    Camera Independent Face Recognition Algorithm In Visual Surveillance

    Camera Independent Face Recognition Algorithm In Visual Surveillance by Yew, Chuu Tian

    Published 2015
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  9. 9
    EBB526-3 - ELECTRONIC PACKAGING - NOVEMBER 2008.

    EBB526-3 - ELECTRONIC PACKAGING - NOVEMBER 2008. by PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral

    Published 2008
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  10. 10
    Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment

    Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment by M.Shukeri, Nurulfaizal

    Published 2017
    Subjects: “…TK7870 Electronic packaging…”
    Get full text
    Get full text
  11. 11
    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy

    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy by Abdullah, Syahrul Afzal Che

    Published 2016
    Subjects: Get full text
    Get full text
  12. 12
    Validation of Colpitts Vco Design for Two Way Portable Radio Applications

    Validation of Colpitts Vco Design for Two Way Portable Radio Applications by Raj Arul, Aldrin

    Published 2013
    Subjects: Get full text
    Get full text
  13. 13
    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection

    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection by Lai, Chi Qin

    Published 2016
    Subjects: Get full text
    Get full text
  14. 14
    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification

    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification by Abdul Ghani, Ahmad Shahrizan

    Published 2015
    Subjects: Get full text
    Get full text
  15. 15
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine

    An Expert System for Trouble Shooting - Auto Wire Bonder Machine by Ng, Yu Ting

    Published 1997
    Subjects: “…Wire bonding (Electronic packaging) - Case studies…”
    Get full text
    Get full text
  16. 16
    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 505 – Advanced Analog Integrated Circuit Design

    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 505 – Advanced Analog Integrated Circuit Design by Elektrik & Elektronik, Pusat Pengajian Kejuruteraan

    Published 2018
    Subjects: Get full text
    Get full text
  17. 17
    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE520 – EMBEDDED MICROPROCESSOR SYSTEMS Duration : 3 hours

    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE520 – EMBEDDED MICROPROCESSOR SYSTEMS Duration : 3 hours by Elektrik & Elektronik, Pusat Pengajian Kejuruteraan

    Published 2018
    Subjects: Get full text
    Get full text
  18. 18
    EMC 201 MEASUREMENT & INSTRUMENTATION [PENGUKURAN & PERALATAN] (DECEMBER 2016 / JANUARY 2017)

    EMC 201 MEASUREMENT & INSTRUMENTATION [PENGUKURAN & PERALATAN] (DECEMBER 2016 / JANUARY 2017) by PPKM, Pusat Pengajian Kejuruteraan Mekanikal

    Subjects: Get full text
    Get full text
  19. 19
    EMC 201 MEASUREMENT & INSTRUMENTATION [PENGUKURAN & PERALATAN] (DECEMBER 2016 / JANUARY 2017)

    EMC 201 MEASUREMENT & INSTRUMENTATION [PENGUKURAN & PERALATAN] (DECEMBER 2016 / JANUARY 2017) by PPKM, Pusat Pengajian Kejuruteraan Mekanikal

    Published 2017
    Subjects: Get full text
    Get full text
  20. 20
    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 322 – RF & MICROWAVE ENGINEERING (KEJURUTERAAN GELOMBANG MIKRO & RF)Duration : 2 hours (Masa : 2 jam)

    Second Semester Examination 2017/2018 Academic Session May/June 2018 EEE 322 – RF & MICROWAVE ENGINEERING (KEJURUTERAAN GELOMBANG MIKRO & RF)Duration : 2 hours (Masa : 2 jam) by Elektrik & Elektronik, Pusat Pengajian Kejuruteraan

    Published 2018
    Subjects: Get full text
    Get full text

Search Tools: