Search Results - "Wire bonding process parameters"

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    Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

    Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods by Arjmand, E., Agyakwa, P.A., Johnson, C.M.

    Published 2014
    Subjects: “…Wire bonding process parameters…”
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