Search Results - "Solid solution"

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    Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment by Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark

    Published 2014
    Subjects: “…Transient liquid phase (TLP) bonding; Die attachment; Diffusion; Interfacial reaction; Intermetallic compounds; Solid solution…”
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