Search Results - "Scanning electron microscopy"

Optimizing nano-solution coating method and ball milling method to achieve maximum non-linearity property for ZnO-based low-voltage varistor ceramics by Dorraj, Masoumeh

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Physiological, biochemical, and ultrastructural characterization of selenium toxicity in cowpea plants by Silva, Vinícius Martins, Boleta, Eduardo Henrique Marcandalli, Lanza, Maria Gabriela Dantas Bereta, Lavres, Jose, Martins, Juliana Trindade, Santos, Elcio Ferreira, dos Santos, Flávia Lourenço Mendes, Putti, Fernando Ferrari, Junior, Enes Furlani, White, Philip J., Broadley, Martin R., de Carvalho, Hudson Wallace Pereira, dos Reis, André Rodrigues

Subjects: “…Vigna unguiculata; antioxidant metabolism; photosynthetic pigments; toxicity; scanning electron microscopy…”
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The role of ettringite in the deterioration of artificial lime stabilised soils: a microstructural study by Buttress, A.J., Grenfell, J.R.A., Airey, Gordon

Subjects: “…swell test; lime; soil; ettringite; scanning electron microscopy; electron dispersive X-ray spectroscopy…”
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An electrochemical impedance spectroscopy and scanning electron microscopy study of the influence of positive plate compression on the electrochemical behaviour of lead-acid batter... by De Marco, Roland, Lowe, Alexander, Sercombe, Matthew, Singh, P.

Subjects: “…Scanning electron microscopy…”
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Characterization of the pore structure of metakaolin-derived geopolymers by neutron scattering and electron microscopy by Maitland, Clinton, Buckley, Craig, O'Connor, Brian, Butler, P., Hart, Robert

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Correlative FIB-SEM and TEM investigation of the magnesium electrode by Sankowsi, Andrzej

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Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior by Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark

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Catalytic carbon deposition on 3-dimensional carbon fibre supports by Thornton, Matthew James

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Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

Subjects: “…Reliability; Planar interconnect; Power semiconductor; Finite element method; Power cycling; Sn-3.5Ag solder alloy; Scanning electronic microscopy…”
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Lithofacies and Sequence stratigraphic Framework of the Kockatea Shale, Dandaragan Trough, Perth Basin by Jafary Dargahi, H., Rezaee, M. Reza

Subjects: “…scanning electron microscopy (SEM)…”
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