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    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

    Published 2018
    Subjects: “…Reliability; Planar interconnect; Power semiconductor; Finite element method; Power cycling; Sn-3.5Ag solder alloy; Scanning electronic microscopy…”
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