Search Results - "Power cycling"

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  1. 1
    Assessing the accuracy of loss estimation methods for supercapacitor energy storage devices operating under constant power cycling

    Assessing the accuracy of loss estimation methods for supercapacitor energy storage devices operating under constant power cycling by Kulsangcharoen, Ponggorn, Klumpner, Christian, Rashed, Mohamed, Asher, Greg, Chen, George Z., Norman, Stuart A.

    Published 2014
    Subjects: Get full text
  2. 2
    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

    Published 2018
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  3. 3
    Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K

    Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K by Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin, Johnson, Christopher Mark

    Published 2016
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  4. 4
    Improved reliability of planar power interconnect with ceramic-based structure

    Improved reliability of planar power interconnect with ceramic-based structure by Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren, Johnson, Christopher Mark

    Published 2018
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  5. 5
    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

    Published 2018
    Subjects: “…Reliability; Planar interconnect; Power semiconductor; Finite element method; Power cycling; Sn-3.5Ag solder alloy; Scanning electronic microscopy…”
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