Search Results - "MMIC"

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  1. 1

    Simulation and characterization of PZT thin film capacitors for MMIC applications / Nor Fazlina Mohd Lazim by Mohd Lazim, Nor Fazlina

    Published 2008
    “…To the author’s knowledge this project constitutes the first work on PZT thin film capacitors for MMIC applications.…”
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  2. 2

    Design And Simulation Of Resonant Tunneling Diode (RTD) Based High Frequency Monolithic Microwave Integrated Circuit (MMIC) by Chia, Ying Ying

    Published 2018
    “…Hence, this paper has demonstrated a series of monolithic microwave integrated circuit (MMIC) oscillators with the appropriate RTD models created. …”
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  3. 3

    Performance analysis of parasitic effect on distributed spiral inductor for 0.15 μm GaAs pHEMT MMIC low noise amplifier by Norhapizin, Kushairi, Rasidah, Sanusi, Yusnita, Rahayu

    Published 2012
    “…This paper presents the effect of measured distributed spiral inductor in monolithic microwave integrated circuit (MMIC) low noise amplifier (LNA) performance. Using S-parameter simulation, the LNA performance between lump and distributed circuit are compared at 2.4 GHz. …”
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  4. 4

    Design of monolithic microwave integrated circuit filters using electromagnetic simulation / Ahmad Asari Sulaiman by Sulaiman, Ahmad Asari

    Published 2005
    “…This thesis reports a research carried out to design monolithic microwave integrated circuit (MMIC) low pass filters using circuit and electromagnetic simulations. …”
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  5. 5

    Co-planar microwave integrated circuit transmission lines based on carbon nanotube and graphene / Mohsen Hassan Salem Kara by Kara, Mohsen Hassan Salem

    Published 2016
    “…The aim of this work is to study the feasibility of using carbon nanotube and graphene as new conductor materials for microwave integrated circuits (MMIC). As the dimensions of integrated circuits scale down to nanometers, the conductor resistance at high frequencies increase due to skin effect, and consequently the performance of MMICs degrade. …”
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  6. 6

    Design And Simulation Of High Q Inductors On Au-Compensated High Resistivity Silicon by Yap, Chee Seong

    Published 2017
    “…The Au-compensated high resistivity can be used as a base substrate which able to be incorporated into the RF-MMIC technology such as integration of IPDs, TSVs and buried oxide. …”
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  7. 7

    Modelling of advanced submicron gate InGaAs/InAIAs pHEMTS and RTD devices for very high frequency applications by Mat Jubadi, Warsuzarina

    Published 2015
    “…The aims to develop linear and nonlinear models for sub-μm transistors and their implementation in MMIC LNA design is achieved with the 0.25 m In0.7Ga0.3As/In0.52Al0.48As/InP pHEMT. …”
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  8. 8

    Co-planar microwave integrated circuit transmission lines based on carbon nanotube and graphene / Mohsen H S Ben Kara by H S Ben Kara, Mohsen

    Published 2016
    “…The aim of this work is to study the feasibility of using carbon nanotube and graphene as new conductor materials for microwave integrated circuits (MMIC). As the dimensions of integrated circuits scale down to nanometers, the conductor resistance at high frequencies increase due to skin effect, and consequently the performance of MMICs degrade. …”
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  9. 9

    Hybrid microwave power amplifiers for broadband communication / Pragash Sangaran by Pragash , Sangaran

    Published 2020
    “…Conventional DPA and MA design techniques are only suitable for MMIC implementation because the availability of arbitrary values of lumped element Lc, Ld, Lb, and Cadd is only possible in MMIC technology. …”
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  10. 10

    Implementation of lead niobate zirconate titanate (PNZT) thin films as passive monolithic microwave integrated circuit elements / Suhana Sulaiman by Sulaiman, Suhana

    Published 2013
    “…This research is focused on microwave characterization of films made of these materials for monolithic microwave integrated circuit (MMIC) applications. Both films are deposited on silicon substrates using different deposition techniques. …”
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  11. 11

    An electrical equivalent circuit to simulate the output power of an AlGaAs/GaAs planar Gunn diode by Maricar, Mohamed Ismaeel, Khalid, Ata, Dunn, Geoff, Greedy, Steve, Thomas, David W.P., Cumming, D.R.S., Oxley, C.H.

    Published 2018
    “…The planar Gunn diode offers the potential of microwave, milli-metric and THz based oscillator which can be fabricated as part of a microwave monolithic integrated circuit (mmic). To-date the RF output power has been too low for many applications. …”
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  12. 12

    Mopra line survey mapping of NGC 6334 I and I(N) at 3mm by Walsh, Andrew, Thorwirth, S., Beuther, H., Burton, M.

    Published 2010
    “…This investigation has made use of the recently installed 3mm MonolithicMicrowave Integrated Circuit (MMIC) receiver and the Mopra Spectrometer with broad-bandcapabilities permitting total coverage of the entire frequency range with just five differentobservations. …”
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  13. 13

    Implementation of lead niobate zirconate titanate (PNZT) thin films as passive monolithic microwave integrated circuit elements / Suhana Sulaiman by Sulaiman, Suhana

    Published 2013
    “…This research is focused on microwave characterization of films made of these materials for monolithic microwave integrated circuit (MMIC) applications. Both films are deposited on silicon substrates using different deposition techniques. …”
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  14. 14

    Modeling Of Electromagnetic Wave Propagation In Printed Circuit Board And Related Structures by Kung, Fabian Wai Lee

    Published 2003
    “…Related structures imply this framework can be generalized to environments such as Monolithic Microwave Integrated Circuit (MMIC) and the semiconductor itself. The proposed method-of-choice for approximating a solution to the Maxwell's equations for this environment is the Finite-Difference Time-Domain (FDTD) approach, which was originally proposed by K.S.Yee in 1966 (Yee 1996). …”
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  15. 15

    Modeling Of Electromagnetic Wave Propagation In Printed Circuit Board And Related Structures by Kung, Fabian Wai Lee

    Published 2003
    “…Related structures imply this framework can be generalized to environments such as Monolithic Microwave Integrated Circuit (MMIC) and the semiconductor itself. The proposed method-of-choice for approximating a solution to the Maxwell's equations for this environment is the Finite-Difference Time-Domain (FDTD) approach, which was originally proposed by K.S.Yee in 1966 (Yee 1996). …”
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  16. 16

    Design And Simulation Of Low Noise Amplifier At 28 Ghz For 5g Wireless System by Yusof, Nur Syahadah

    Published 2017
    “…An off-the-shelf GaAs pHEMT MMIC LNA HMC519LC4 from Hittite Corporation is used in layout and fabrication processes. …”
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  17. 17

    Implementation And Characterization Of Low Noise Amplifier At 4GHz Using RF Test Board by Zainal Mokhtar, Khursiah

    Published 2006
    “…This economical, easy-to-use GaAs MMIC Low Noise Amplifier (LNA) is designed for an adaptive CDMA receiver LNA and adaptive CDMA transmit driver amplifier. …”
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  18. 18

    Multiband LTE power amplifier for handset application / Jagadheswaran Rajendran by Jagadheswaran, Rajendran

    Published 2015
    “…The 950μm x 900μm monolithic microwave integrated circuit (MMIC) power amplifier (PA) is fabricated in a 2μm InGaP/GaAs process. …”
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  19. 19

    Plans for planar: phase-noise reduction techniques in voltage-controlled oscillators by Azam, S. M. Kayser, Ibrahimy, Muhammad Ibn, Motakabber, S. M. A., Hossain, A. K. M. Zakir

    Published 2019
    “…Despite the growth of monolithic microwave integrated circuits (MMICs), microstrip planar technology is still used for developing low-phase-noise VCOs due to its design simplicity and low manufacturing cost. …”
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  20. 20

    Improved characteristics of radio frequency interdigital capacitor by Lim, Yun Rou

    Published 2006
    “…Some circuits that would have to be done with GaAs monolithic microwave integrated circuits (MMICs), for instance, are now possible in CMOS. While the transistor speed has been improving significantly, fuller integration of RF integrated circuits (RFICs) is often retarded by the absence of high quality, high rangebility and efficient on-chip passive components. …”
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