Search Results - "Intermetallic compounds"

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  1. 1
    Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya

    Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya by Yahya, Iziana

    Published 2016
    Subjects: “…Intermetallic compounds…”
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  2. 2
    Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad

    Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad by Mayappan, Ramani, Ahmad, Zainal Arifin

    Published 2010
    Subjects: “…Intermetallic compounds…”
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  3. 3
    Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board

    Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board by Dele-Afolabi, Temitope Theophilus

    Published 2015
    Subjects: “…Intermetallic compounds…”
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  4. 4
    Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

    Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment by Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark

    Published 2014
    Subjects: “…Transient liquid phase (TLP) bonding; Die attachment; Diffusion; Interfacial reaction; Intermetallic compounds; Solid solution…”
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  5. 5
    Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging

    Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging by Mohamed Ariff, Azmah Hanim, M. N., Mohamad Aznan, R., Muhammad Raimi, A., Muhammad Azrol Amin

    Published 2016
    Subjects: “…SAC237; Multi-walled carbon nanotubes; ENIG; Immersion tin; As reflow; Isothermal aging; Intermetallic compound…”
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