Search Results - "Bi-layered assembly"

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  1. 1
    Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer

    Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer by Debnath, Sujan, Piaw, T., Woldemichael, Dereje

    Published 2014
    Subjects: Get full text
  2. 2
    Electronic Packaging Model with Continuous and Discontinuous Bond Layer

    Electronic Packaging Model with Continuous and Discontinuous Bond Layer by Ting, K.P., Sujan, Debnath

    Published 2012
    Subjects: Get full text

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